HI-REL FABRICATION

Hi-Rel Fabrication Facility is designed as ISO 7 with Cleanroom Class 10000. It is facilitated with –

• Class 100 (ISO 5) ESD Safe Laminar flow work Benches.
• Temperature and Humidity controlled Storage Chambers.
• ESD Safe Soldering Stations and Pre-heating Plates.
• Ultrasonic and Vapor degreasing Cleaning Systems.
• BGA Soldering Stations.
• 10X - 200X Digital Inspection Microscopes.
• Perylene Coating & Ionic Contamination Testers.
• X-Ray Testing Facility.
• Wire/Ribbon/Die Bonding Facility.
• Bond Pull Testing Facility.
• Dicing System Facility.
• Laser System Facility.

Soldering Iron

Temp Range : 50°C to 550°C Accuracy : ± 5°C

Hot Plate

Temperature : 25°C to 350°C Accuracy : ± 5°C

Solder Pot

Degolding and Tinning Solder Pot

Ultrasonic Baths

Capacity : 1.9 ltr, 9.5 ltr

Vapor Degreaser

Capacity : 27 ltr

Microscope

Magnification : 6X - 55X Resolution : 500lp/mm

Digital Microscope

Magnification : 10X - 200X Resolution : 1600lp/mm

Digital Microscope

Magnification : 45x Resolution : 1080p

X-ray testing

FoV : 25mm Magnification : 7x - 500x

IC Forming & Cutting

Forming Rate : 1000 parts/Hr

Ionic Contamination Tester

(Board Capacity : 12" x 12" )

Parylene Coating

Chamber Size : 13 inch dia x 14.20 inch height

Universal Oven

Temperature Range : 20°C to 300°C

BGA Solder Station

Working area : 400X400 mm Temperature : 20°C to 475°C

Dicing Machine

Blade RPM: 60,000 Accuracy : 1.5 µ

Wire & Ribbon Bonding Machine

(Al/Au wire : 17-75µm (0.7-3 mil)) (Ribbon : 25 x 250µm (1x8 mil))

Fine Chip Bonder

Die Size : 1 x 1 inch

Ribbon Bonder

Au Ribbon: 1 mil, 5 mil, 10 mil, 20 mil

Bond Pull Tester

Force : 0.5 – 132 gm

Laser Lithography Machine

Laser Wavelength : 1030nm Frequency : 200 kHz